Process kit geometry for particle reduction in PVD processes
US11935732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2019 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Jul 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process kit comprises a shield and ring assembly for positioning about a substrate support in a processing chamber to reduce deposition of process deposits on internal chamber components and an overhang edge of the substrate. The shield comprises a cylindrical band having a top wall configured to surround a sputtering target and a sloped portion of a bottom wall having a substantially straight profile with gas conductance holes configured to surround the substrate support. The ring assembly comprises a cover ring having a bulb-shaped protuberance about the periphery of the ring. The bulb-shaped protuberance of the cover ring is able to block a line-of-sight between the gas conductance holes on the shield and an entrance to a chamber body cavity in the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.