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US11946140B2 · kind B2 · utility

0Cited by
1References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 2021
Grant dateApr 2, 2024
Priority date
Expiry dateMar 22, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/32348
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.