Apparatus with multi-wafer based device and method for forming such
US11948831B2 · kind B2 · utility
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25Claims
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Key dates
| Filing date | May 17, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided which comprises: a substrate; one or more active devices adjacent to the substrate; a first set of one or more layers to interconnect the one or more active devices; a second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.