Device and method for bonding of substrates
US11955339B2 · kind B2 · utility
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16References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 14, 2021 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jul 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.