Transmission-based temperature measurement of a workpiece in a thermal processing system

US11955388B2 · kind B2 · utility

Assignees

• Beijing E-Town Semiconductor Technology Co., Ltd. · CN
• Mattson Technology, Inc. · US

Inventors

• Michael Storek · Tomerdingen, DE
• Rolf Bremensdorfer · Bibertal, DE
• Markus Lieberer · Augsburg, DE
• Michael X. Yang · Palo Alto, US

Key dates

• Filing date: Mar 17, 2023
• Grant date: Apr 9, 2024
• Expiry date: Mar 17, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J2001/4242
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.