Patent · US Active

Semiconductor device package comprising a pin in the form of a drilling screw

US11955415B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Thorsten Scharf · Regensburg, DE
Thomas Bemmerl · Schwandorf, DE
Martin Gruber · Schwandorf, DE
Thorsten Meyer · Regensburg, DE
Frank Singer · Regenstauf, DE

Key dates

Filing date	Jun 28, 2021
Grant date	Apr 9, 2024
Priority date	—
Expiry date	Oct 8, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The semiconductor device package comprises a die carrier, at least one semiconductor die disposed on the carrier, the semiconductor die comprising at least one contact pad on a main face remote from the carrier, an encapsulant disposed above the semiconductor die, an electrical connector electrically connected with the contact pad, a drilling screw screwed through the encapsulant and connected with the electrical connector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.