Localized high density substrate routing
US11984396B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2022 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Dec 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.