Reduced localized force in electrostatic chucking
US12033881B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor substrate support assemblies may include an electrostatic chuck body having a substrate support surface. The electrostatic chuck body may define a plurality of protrusions extending from the substrate support surface. The assemblies may include an electrode embedded within the electrostatic chuck body. The electrode may define apertures through the electrode in line with the plurality of protrusions extending from the substrate support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.