Die sidewall coatings and related methods
US12040192B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2022 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jul 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.