Method and apparatus for optimization of lithographic process
US12044981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Oct 8, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.