Package structure and manufacturing method of package structure thereof
US12051666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Sep 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.