Electronic substrates having embedded inductors

US12057252B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Benjamin Duong · Chandler, US
• Michael Garelick · Chandler, US
• Darko Grujicic · Chandler, US
• Tarek A. Ibrahim · Mesa, US
• Brandon C. Marin · Chandler, US
• Sai Vadlamani · Chandler, US
• Marcel Wall · Phoenix, US

Key dates

• Filing date: Sep 23, 2020
• Grant date: Aug 6, 2024
• Expiry date: Sep 6, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/49816
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

An electronic substrate may be fabricated by forming a base substrate and forming an inductor extending through the base substrate, wherein the inductor includes a magnetic material layer and a barrier layer, such that the barrier layer prevents the magnetic material layer from leaching into plating solutions during the fabrication of the electronic substrate. In one embodiment, the barrier material may comprise titanium. In another embodiment, the barrier layer may comprise a polymeric material. In still another embodiment, the barrier layer may comprise a nitride material layer. The inductor may further include a plating seed layer on the barrier layer and a conductive fill material abutting the plating seed layer.