Substrate processing apparatus and substrate processing method
US12057327B2 · kind B2 · utility
0Cited by
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8Claims
0Family size
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Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.