Method with mechanical dicing process for producing MEMS components
US12060266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Feb 3, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for producing MEMS components comprises generating a carrier having a plurality of recesses. An adhesive structure is arranged on the carrier and in the recesses. A semiconductor wafer is generated, which has a plurality of MEMS structures arranged at the first main surface of the semiconductor wafer. The adhesive structure is attached to the first main surface of the semiconductor wafer, with the recesses being arranged above the MEMS structures and the adhesive structure not contacting the MEMS structures. The semiconductor wafer is singulated into a plurality of MEMS components by applying a mechanical dicing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.