Patent · US Active

Microelectronic assemblies with inductors in direct bonding regions

US12062631B2 · kind B2 · utility

2Cited by

0References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Adel A. Elsherbini · Chandler, US
Krishna Bharath · Phoenix, US
Kevin P. O'Brien · Cincinnati, US
Kimin Jun · Hillsboro, US
Han Wui Then · Portland, US
Mohammad Enamul Kabir · Portland, US
Gerald Pasdast · San Jose, US
Feras Eid · Chandler, US
Aleksandar Aleksov · Chandler, US
Johanna M. Swan · Scottsdale, US
Shawna M. Liff · Scottsdale, US

Key dates

Filing date	Sep 18, 2020
Grant date	Aug 13, 2024
Priority date	—
Expiry date	Dec 12, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18161
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.