High density plasma enhanced process chamber
US12080516B2 · kind B2 · utility
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1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2021 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Nov 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to a showerhead for distributing plasma. The showerhead includes a perforated tile coupled to a support structure. A dielectric window is disposed over the perforated tile. An electrode is coupled to the dielectric window. An inductive coupler is disposed over the dielectric window. At least a portion of the inductive coupler is angled relative to at least a portion of the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.