Patent · US Active

Method for increasing the surface roughness of a metal layer

US12094722B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Olivier Pollet · Grenoble, FR
Laurent Grenouillet · Voiron, FR
Nicolas Posseme · Grenoble, FR

Key dates

Filing date	Nov 26, 2021
Grant date	Sep 17, 2024
Priority date	—
Expiry date	Mar 13, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH04L2209/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for increasing the surface roughness of a metal layer, includes depositing on the metal layer a sacrificial layer made of a dielectric material including nitrogen; exposing a surface of the sacrificial layer to an etching plasma so as to create asperities; and etching the metal layer through the sacrificial layer, so as to transfer the asperities of the sacrificial layer into a part at least of the metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.