Air spacer formation with a spin-on dielectric material
US12094952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2023 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Apr 10, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/40
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.