Tetsuji Ueno
31Patents
4h-index
27Co-inventors
63Inventor score
Filing activity: Dec 27, 2002 → Jan 24, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7952147B2 | Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same | Electricity | 121 | Active |
| US7361563B2 | Methods of fabricating a semiconductor device using a selective epitaxial growth technique | Electricity | 74 | Active |
| US7601983B2 | Transistor and method of manufacturing the same | Electricity | 8 | Expired |
| US6777728B2 | Semiconductor device and complementary semiconductor device | Electricity | 6 | Expired |
| US7439596B2 | Transistors for semiconductor device and methods of fabricating the same | Electricity | 4 | Expired |
| US7611973B2 | Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same | Electricity | 3 | Active |
| US7611951B2 | Method of fabricating MOS transistor having epitaxial region | Electricity | 3 | Active |
| US11296187B2 | Seal material for air gaps in semiconductor devices | Electricity | 3 | Active |
| US7714394B2 | CMOS semiconductor devices having elevated source and drain regions and methods of fabricating the same | Electricity | 3 | Expired |
| US7682888B2 | Methods of forming NMOS/PMOS transistors with source/drains including strained materials | Electricity | 2 | Active |
| US7365010B2 | Semiconductor device having carbon-containing metal silicide layer and method of fabricating the same | Electricity | 2 | Expired |
| US7582535B2 | Method of forming MOS transistor having fully silicided metal gate electrode | Electricity | 2 | Expired |
| US7619285B2 | Method of fabricating CMOS transistor and CMOS transistor fabricated thereby | Electricity | 2 | Active |
| US7728393B2 | Semiconductor device | Electricity | 1 | Active |
| US7791146B2 | Semiconductor device including field effect transistor and method of forming the same | Electricity | 1 | Active |
| US11688766B2 | Seal material for air gaps in semiconductor devices | Electricity | 1 | Active |
| US7776723B2 | Method of manufacturing an epitaxial semiconductor substrate and method of manufacturing a semiconductor device | Emerging Cross-Sectional Technologies | 1 | Active |
| US12324200B2 | Seal material for air gaps in semiconductor devices | Electricity | 0 | Active |
| US10453925B2 | Epitaxial growth methods and structures thereof | Electricity | 0 | Active |
| US11848238B2 | Methods for manufacturing semiconductor devices with tunable low-k inner air spacers | Electricity | 0 | Active |
| US12369388B2 | Semiconductor devices with tunable low-K inner air spacers | Electricity | 0 | Active |
| US12369374B2 | Epitaxial growth methods and structures thereof | Electricity | 0 | Active |
| US11626482B2 | Air spacer formation with a spin-on dielectric material | Emerging Cross-Sectional Technologies | 0 | Active |
| US12094952B2 | Air spacer formation with a spin-on dielectric material | Emerging Cross-Sectional Technologies | 0 | Active |
| US8445968B2 | Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.