Methods and systems for filling a gap

US12104244B2 · kind B2 · utility

Assignee

• ASM IP Holding B.V. · NL

Inventors

• Charles Dezelah · Helsinki, FI
• Timothee Blanquart · Tama, JP
• René Henricus Jozef Vervuurt · Leuven, BE
• Viljami Pore · Helsinki, FI

Key dates

• Filing date: Sep 27, 2022
• Grant date: Oct 1, 2024
• Expiry date: Sep 27, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76882
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Disclosed are methods and systems for filling a gap. An exemplary method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises forming a convertible layer on the substrate and exposing the substrate to a conversion reactant. Accordingly, at least a part of the convertible layer is converted into a gap filling fluid. The gap filling fluid at least partially fills the gap. The methods and systems are useful, for example, in the field of integrated circuit manufacture.