Microelectronic assemblies with inductors in direct bonding regions

US12107060B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Adel A. Elsherbini · Chandler, US
• Zhiguo Qian · Chandler, US
• Gerald Pasdast · San Jose, US
• Mohammad Enamul Kabir · Portland, US
• Han Wui Then · Portland, US
• Kimin Jun · Hillsboro, US
• Kevin P. O'Brien · Cincinnati, US
• Johanna M. Swan · Scottsdale, US
• Shawna M. Liff · Scottsdale, US
• Aleksandar Aleksov · Chandler, US
• Feras Eid · Chandler, US

Key dates

• Filing date: Sep 18, 2020
• Grant date: Oct 1, 2024
• Expiry date: Jan 7, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/96
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.