Semiconductor device having a silicon carbide drift zone over a silicon carbide field stop zone
US12107141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a silicon carbide (SiC) drift zone over a SiC field stop zone and/or a SiC semiconductor substrate. A concentration of Z1/2 defects in the SiC drift zone is at least one order of magnitude smaller than in the SiC field stop zone and/or the SiC semiconductor substrate. Separately or in combination, a concentration of Z1/2 defects in a part of the SiC drift zone is at least one order of magnitude smaller than in another part of the drift zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.