Patent · US Active

Lead adapters for semiconductor package

US12113000B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ajay Pai · Crystal, US
Tino Karczewski · Sinzing, DE
Adrian Lis · Regensburg, DE

Key dates

Filing date	Dec 2, 2021
Grant date	Oct 8, 2024
Priority date	—
Expiry date	Jun 15, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/1059
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a first semiconductor die, an encapsulant body of electrically insulating mold compound that encapsulates the first semiconductor die, a plurality of power leads that protrude out of the encapsulant body and form power connections with the first semiconductor die, and a signal lead that protrudes out of the encapsulant body and forms a signal connection with the first semiconductor die, wherein the signal lead comprises a lead adapter retention feature that is configured to form an interlocked connection with a lead adapter that is fitted over an outer end of the signal lead.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.