Sacrificial protection layer for environmentally sensitive surfaces of substrates
US12119218B2 · kind B2 · utility
1Cited by
12References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 28, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jan 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.