Bonded assembly containing different size opposing bonding pads and methods of forming the same
US12125814B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | Feb 8, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Dec 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1438
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonded assembly of a primary semiconductor die and a complementary semiconductor die includes first pairs of first primary bonding pads and first complementary bonding pads that are larger in area than the first primary bonding pads, and second pairs of second primary bonding pads and second complementary bonding pads that are smaller in area than the second primary bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.