Inventor · Leuven, BE

Lin Hou

25Patents
2h-index
50Co-inventors
56Inventor score

Filing activity: Dec 16, 2011 → Jun 24, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US11348901B1 Interfacial tilt-resistant bonded assembly and methods for forming the same Electricity 3 Active
US11562975B2 Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same Electricity 3 Active
US11869877B2 Bonded assembly including inter-die via structures and methods for making the same Electricity 2 Active
US11424215B2 Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners Electricity 2 Active
US11547943B2 Providing social network content in games Human Necessities 2 Active
US9844728B2 Providing social network content in games Human Necessities 2 Active
US11646283B2 Bonded assembly containing low dielectric constant bonding dielectric material Electricity 1 Active
US8974188B2 Blade clip Emerging Cross-Sectional Technologies 1 Active
US10795228B2 Array substrate with diffuse reflection layer, method for manufacturing the same, and display device comprising the same Electricity 1 Active
US10275978B2 Coin-operated washer/dryer Textiles; Paper 1 Active
US12412854B2 Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same Electricity 0 Active
US11791278B2 Display substrate motherboard and manufacturing method thereof, display substrate and display apparatus Electricity 0 Active
US11362061B2 Method for the electrical bonding of semiconductor components Electricity 0 Active
US12125814B2 Bonded assembly containing different size opposing bonding pads and methods of forming the same Electricity 0 Active
US11637134B2 Array substrate, method for manufacturing the same, and display device Physics 0 Active
US12347804B2 Bonded assembly including interconnect-level bonding pads and methods of forming the same Electricity 0 Active
US11646282B2 Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same Electricity 0 Active
US11121226B2 Thin film transistor and method for manufacturing the same, array substrate and display device Electricity 0 Active
US12026503B2 Device of updating library required by testing program for testing and method thereof Physics 0 Active
US11710747B2 Array substrate, manufacturing method thereof, and display device Physics 0 Active
US12261227B2 Thin film transistor, display substrate and display device with reduced leakage current Electricity 0 Active
US11031419B2 Array substrate, method for manufacturing the same, and display device Physics 0 Active
US11448929B2 Array substrate with light shielding metal portions and manufacturing method thereof, display device Electricity 0 Active
US11398092B2 Parking detection method and device based on visual difference Physics 0 Active
US11948902B2 Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.