Peter Rabkin
133Patents
20h-index
73Co-inventors
93Inventor score
Filing activity: Feb 2, 2001 → Jul 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9530790B1 | Three-dimensional memory device containing CMOS devices over memory stack structures | Electricity | 108 | Active |
| US8847302B2 | Vertical NAND device with low capacitance and silicided word lines | Electricity | 94 | Active |
| US9881929B1 | Multi-tier memory stack structure containing non-overlapping support pillar structures and method of making thereof | Electricity | 73 | Active |
| US9230985B1 | Vertical TFT with tunnel barrier | Electricity | 73 | Active |
| US9177966B1 | Three dimensional NAND devices with air gap or low-k core | Electricity | 58 | Active |
| US9230980B2 | Single-semiconductor-layer channel in a memory opening for a three-dimensional non-volatile memory device | Electricity | 46 | Active |
| US9478495B1 | Three dimensional memory device containing aluminum source contact via structure and method of making thereof | Electricity | 42 | Active |
| US9634097B2 | 3D NAND with oxide semiconductor channel | Electricity | 39 | Active |
| US8933502B2 | 3D non-volatile memory with metal silicide interconnect | Electricity | 38 | Active |
| US8951859B2 | Method for fabricating passive devices for 3D non-volatile memory | Electricity | 36 | Active |
| US9515085B2 | Vertical memory device with bit line air gap | Electricity | 35 | Active |
| US9425299B1 | Three-dimensional memory device having a heterostructure quantum well channel | Electricity | 35 | Active |
| US8643142B2 | Passive devices for 3D non-volatile memory | Electricity | 32 | Active |
| US9721963B1 | Three-dimensional memory device having a transition metal dichalcogenide channel | Electricity | 31 | Active |
| US9711229B1 | 3D NAND with partial block erase | Electricity | 31 | Active |
| US6559008B2 | Non-volatile memory cells with selectively formed floating gate | Electricity | 30 | Expired |
| US6818504B2 | Processes and structures for self-aligned contact non-volatile memory with peripheral transistors easily modifiable for various technologies and applications | Electricity | 25 | Expired |
| US10115459B1 | Multiple liner interconnects for three dimensional memory devices and method of making thereof | Physics | 23 | Active |
| US11107516B1 | Ferroelectric memory devices containing a two-dimensional charge carrier gas channel and methods of making the same | Electricity | 20 | Active |
| US9530506B2 | NAND boosting using dynamic ramping of word line voltages | Physics | 20 | Active |
| US9449985B1 | Memory cell with high-k charge trapping layer | Electricity | 19 | Active |
| US9331093B2 | Three dimensional NAND device with silicon germanium heterostructure channel | Electricity | 18 | Active |
| US9449980B2 | Band gap tailoring for a tunneling dielectric for a three-dimensional memory structure | Electricity | 18 | Active |
| US10319680B1 | Metal contact via structure surrounded by an air gap and method of making thereof | Electricity | 17 | Active |
| US9287290B1 | 3D memory having crystalline silicon NAND string channel | Electricity | 16 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.