Chuck for plasma processing chamber
US12131890B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2020 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Dec 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.