Enabling product SKUs based on chiplet configurations
US12141890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2022 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4027
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.