Electrostatic chuck with seal surface
US12142509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2019 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Nov 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2005
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and systems for pedestals are provided. An example pedestal may have a body with an upper annular seal surface that is planar, perpendicular to a vertical center axis of the body, and has a radial thickness, a lower recess surface offset from the upper annular seal surface, and a plurality of micro-contact areas (MCAs) protruding from the lower recess surface, each MCA having a top surface offset from the lower recess surface by a second distance less, and one or more electrodes within the body. The upper annular seal surface may be configured to support an outer edge of a semiconductor substrate when the semiconductor substrate is being supported by the pedestal, and the upper annular seal surface and the tops of the MCAs may be configured to support the semiconductor substrate when the semiconductor substrate is being supported by the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.