Patent · US Active

Tungsten molybdenum structures

US12159804B2 · kind B2 · utility

0Cited by

36References

8Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Xi Cen · San Jose, US
Kai Wu · Palo Alto, US
Dixiong WANG · Milpitas, US
Yi Luo · Hsinchu, TW

Key dates

Filing date	Mar 9, 2022
Grant date	Dec 3, 2024
Priority date	—
Expiry date	Oct 22, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/28568
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure is provided including a substrate and a tungsten-containing layer. The tungsten-containing layer includes a nucleation layer disposed on the substrate and a bulk layer is disposed over the nucleation layer. The nucleation layer includes tungsten and the bulk layer includes about 0.1% to about 20% atomic molybdenum. The tungsten-containing layer includes a film stress of about 350 MPa to about 450 MPa.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.