Inventor · Palo Alto, CA, US

Kai Wu

34Patents
7h-index
88Co-inventors
68Inventor score

Filing activity: May 15, 2008 → Oct 28, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8900999B1 Low temperature high pressure high H2/WF6 ratio W process for 3D NAND application Electricity 399 Active
US7964505B2 Atomic layer deposition of tungsten materials Electricity 150 Active
US7732327B2 Vapor deposition of tungsten materials Electricity 48 Active
US8071478B2 Method of depositing tungsten film with reduced resistivity and improved surface morphology Electricity 36 Active
US9528183B2 Cobalt removal for chamber clean or pre-clean process Performing Operations; Transporting 24 Active
US8865594B2 Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance Electricity 9 Active
US9169556B2 Tungsten growth modulation by controlling surface composition Chemistry; Metallurgy 8 Active
US8617985B2 High temperature tungsten metallization process Electricity 6 Active
US9748105B2 Tungsten deposition with tungsten hexafluoride (WF6) etchback Electricity 5 Active
US9653352B2 Methods for forming metal organic tungsten for middle of the line (MOL) applications Electricity 4 Active
US10256144B2 Process integration approach of selective tungsten via fill Electricity 4 Active
US8835311B2 High temperature tungsten metallization process Electricity 3 Active
US8920564B2 Methods and apparatus for thermal based substrate processing with variable temperature capability Chemistry; Metallurgy 2 Active
US8513116B2 Atomic layer deposition of tungsten materials Electricity 2 Active
US10395916B2 In-situ pre-clean for selectivity improvement for selective deposition Electricity 2 Active
US8211799B2 Atomic layer deposition of tungsten materials Electricity 1 Active
US9051655B2 Boron ionization for aluminum oxide etch enhancement Electricity 1 Active
US9947578B2 Methods for forming low-resistance contacts through integrated process flow systems Electricity 1 Active
US10727119B2 Process integration approach of selective tungsten via fill Electricity 1 Active
US9783889B2 Apparatus for variable substrate temperature control Chemistry; Metallurgy 1 Active
US12159804B2 Tungsten molybdenum structures Electricity 0 Active
US12191198B2 Low resistivity tungsten film and method of manufacture Electricity 0 Active
US12113020B2 Formation of metal vias on metal lines Electricity 0 Active
US11380536B2 Multi-step pre-clean for selective metal gap fill Electricity 0 Active
US11776806B2 Multi-step pre-clean for selective metal gap fill Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.