Lithographic apparatus and electrostatic clamp designs
US12174552B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 5, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments herein describe methods, devices, and systems for reducing an electric field at a clamp-reticle interface using an enhanced electrostatic clamp. In particular, the electrostatic clamp includes a clamp body, an electrode layer disposed on a top surface of the clamp body, and a plurality of burls that project from a bottom surface of the clamp body, wherein the electrode layer comprises a plurality of cutouts at predetermined locations that vertically correspond to locations of the plurality of burls at the bottom surface of the clamp body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.