Semiconductor package with metal posts from structured leadframe

US12176222B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Chau Fatt Chiang · Melaka City, MY
• Thorsten Meyer · Regensburg, DE
• Chan Lam Cha · Melaka City, MY
• Wern Ken Daryl Wee · Melaka City, MY
• Chee Hong Lee · 流花街道, CN
• Swee Kah Lee · Melaka City, MY
• Norliza Morban · Melaka City, MY
• Khay Chwan Saw · Melaka City, MY

Key dates

• Filing date: Nov 29, 2021
• Grant date: Dec 24, 2024
• Expiry date: Mar 25, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/36
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.