Workpiece processing apparatus with thermal processing systems

US12183558B2 · kind B2 · utility

Assignees

• Beijing E-Town Semiconductor Technology Co., Ltd. · CN
• Mattson Technology, Inc. · US

Inventors

• Dixit V. Desai · Pleasanton, US
• Alex Wansidler · Ulm, DE
• Dieter Hezler · Lonsee, DE
• Joseph Cibere · Burnaby, CA
• Rolf Bremensdorfer · Bibertal, DE
• Pete Lembesis · Langley, CA
• Michael X. Yang · Palo Alto, US

Key dates

• Filing date: Oct 25, 2023
• Grant date: Dec 31, 2024
• Expiry date: Oct 25, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/20214
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.