Use of vacuum during transfer of substrates
US12186851B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2020 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jul 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.