Monolithic modular microwave source with integrated process gas distribution
US12191118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2024 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 22, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/335
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.