Method of determining control parameters of a device manufacturing process
US12197136B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2023 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Aug 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method including: obtaining an image of at least part of a substrate, wherein the image includes at least one feature manufactured on the substrate by a manufacturing process including a lithographic process and one or more further processes; determining one or more image-related metrics in dependence on a contour determined from the image, wherein one of the one or more image-related metrics is an edge placement error, EPE, of the at least one feature; and determining one or more control parameters of the lithographic process and/or the one or more further processes in dependence on the edge placement error, wherein at least one control parameter is determined so as to minimize the edge placement error of the at least one feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.