Electronic device with top side pin array and manufacturing method thereof
US12205827B2 · kind B2 · utility
0Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2020 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Dec 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.