Processing chamber deposition confinement
US12211673B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2020 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Nov 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The system may include a substrate support extending through the base of the chamber body. The chamber body may define an access circumferentially extending about the substrate support at the base of the chamber body. The system may include one or more isolators disposed within the chamber body. The one or more isolators may define an exhaust path between the one or more isolators and the chamber body. The exhaust path may extend to the base of the chamber body. The systems may include a fluid source fluidly coupled with the chamber body at the access extending about the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.