Inventor · Redwood City, CA, US

Kwangduk Douglas Lee

59Patents
6h-index
113Co-inventors
71Inventor score

Filing activity: Jul 18, 2006 → Jun 6, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8560134B1 System and method for electric load recognition from centrally monitored power signal and its application to home energy management Emerging Cross-Sectional Technologies 72 Active
US8361906B2 Ultra high selectivity ashable hard mask film Electricity 53 Active
US8536065B2 Ultra high selectivity doped amorphous carbon strippable hardmask development and integration Electricity 46 Active
US8993454B2 Ultra high selectivity doped amorphous carbon strippable hardmask development and integration Electricity 14 Active
US10403535B2 Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system Electricity 7 Active
US9299581B2 Methods of dry stripping boron-carbon films Electricity 7 Active
US9711360B2 Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD system Electricity 5 Active
US9390910B2 Gas flow profile modulated control of overlay in plasma CVD films Electricity 5 Active
US10580623B2 Plasma processing using multiple radio frequency power feeds for improved uniformity Electricity 3 Active
US10100408B2 Edge hump reduction faceplate by plasma modulation Electricity 3 Active
US10418243B2 Ultra-high modulus and etch selectivity boron-carbon hardmask films Electricity 3 Active
US8105465B2 Method for depositing conformal amorphous carbon film by plasma-enhanced chemical vapor deposition (PECVD) Electricity 3 Active
US10727059B2 Highly etch selective amorphous carbon film Electricity 3 Active
US7776516B2 Graded ARC for high NA and immersion lithography Electricity 3 Active
US10879041B2 Method and apparatus of achieving high input impedance without using ferrite materials for RF filter applications in plasma chambers Electricity 2 Active
US10504727B2 Thick tungsten hardmask films deposition on high compressive/tensile bow wafers Electricity 2 Active
US10236225B2 Method for PECVD overlay improvement Electricity 2 Active
US10373822B2 Gas flow profile modulated control of overlay in plasma CVD films Electricity 2 Active
US11469107B2 Highly etch selective amorphous carbon film Electricity 2 Active
US9947599B2 Method for PECVD overlay improvement Electricity 2 Active
US11728168B2 Ultra-high modulus and etch selectivity boron-carbon hardmask films Electricity 1 Active
US11584994B2 Pedestal for substrate processing chambers Electricity 1 Active
US9837265B2 Gas flow profile modulated control of overlay in plasma CVD films Electricity 1 Active
US8513129B2 Planarizing etch hardmask to increase pattern density and aspect ratio Electricity 1 Active
US10679830B2 Cleaning process for removing boron-carbon residuals in processing chamber at high temperature Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.