Lift pin mechanism

US12211734B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Alexander SULYMAN · San Francisco, US
• Carlaton WONG · Sunnyvale, US
• Rajinder Dhindsa · Pleasanton, US
• Timothy Joseph Franklin · Campbell, US
• Steven E. Babayan · Los Altos, US
• Anwar Husain · Pleasanton, US
• James Rogers · Milpitas, US
• Xue Yang Chang · San Jose, US

Key dates

• Filing date: Mar 7, 2022
• Grant date: Jan 28, 2025
• Expiry date: Mar 8, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6833
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.