Methods for depositing gap filling fluid
US12211742B2 · kind B2 · utility
0Cited by
2,093References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2021 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | May 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5329
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses. The recesses are at least partially filled with a gap filling fluid. The gap filling fluid comprises boron, nitrogen, and hydrogen. The gap filling fluid can be formed by introducing a precursor into the reaction chamber and introducing a co-reactant into the reaction chamber to form a gap filling fluid that at least partially fills the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.