Metrology and process control for semiconductor manufacturing
US12236364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Sep 18, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor metrology system including a spectrum acquisition tool for collecting, using a first measurement protocol, baseline scatterometric spectra on first semiconductor wafer targets, and for various sources of spectral variability, variability sets of scatterometric spectra on second semiconductor wafer targets, the variability sets embodying the spectral variability, a reference metrology tool for collecting, using a second measurement protocol, parameter values of the first semiconductor wafer targets, and a training unit for training, using the collected spectra and values, a prediction model using machine learning and minimizing an associated loss function incorporating spectral variability terms, the prediction model for predicting values for production semiconductor wafer targets based on their spectra.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.