Patent · US Active

Device and method for measuring wafers

US12264914B2 · kind B2 · utility

0Cited by

3References

14Claims

0Family size

Assignee

PRECITEC OPTRONIK GMBH · DE

Inventors

Stephan Weiß · Rodgau, DE
Simon Mieth · Frankfurt, DE
Corinna Weigelt · Langen, DE
Tobias Beck · Stuttgart, DE

Key dates

Filing date	May 23, 2024
Grant date	Apr 1, 2025
Priority date	—
Expiry date	May 23, 2044

Classification

Technology area (CPC G)Physics
CPC primaryG01B2210/56
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A device for measuring wafers includes an optical coherence tomograph and a scanning device that scans the surface of the wafer successively at a plurality of measuring points. Two measuring points have a distance dmax of 140 mm≤dmax≤600 mm. An evaluation unit calculates distance values and/or thickness values from the interference signals provided by the optical coherence tomograph.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.