Composition and method for fabrication of nickel interconnects
US12270121B2 · kind B2 · utility
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3References
19Claims
0Family size
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Key dates
| Filing date | Jan 31, 2020 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.