Liquid-in-liquid cooling system for electronic components
US12289861B2 · kind B2 · utility
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95References
24Claims
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Key dates
| Filing date | Nov 10, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F23/263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system and method of cooling electronic components comprising a tank (or other vessel) in which a dielectric liquid cools low power electronic components within the tank, while a conductive liquid cools high power electronic components in the tank. The conductive liquid is supplied via a plurality of cooling modules, each arranged on or in proximity to a high power component. A cooling module arranged within the tank may enclose one or more of the electronic components in the tank using a fluid-tight seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.