Patent · US Active

Solder stop feature for electronic devices

US12300643B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ivan Nikitin · Regensburg, DE
Adrian Lis · Regensburg, DE
Peter Scherl · Regensburg, DE
Achim Althaus · Regensburg, DE

Key dates

Filing date	Nov 30, 2021
Grant date	May 13, 2025
Priority date	—
Expiry date	Oct 3, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10363
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Described are solder stop features for electronic devices. An electronic device may include an electrically insulative substrate, a metallization on the electrically insulative substrate, a metal structure attached to a first main surface of the metallization via a solder joint, and a concavity formed in a sidewall of the metallization. The concavity is adjacent at least part of the solder joint and forms a solder stop. A first section of the metal structure is spaced apart from both the metallization and solder joint in a vertical direction that is perpendicular to the first main surface of the metallization. A linear dimension of the concavity in a horizontal direction that is coplanar with the metallization is at least twice the distance by which the first section of the metal structure is spaced apart from the first main surface of the metallization in the vertical direction. Additional solder stop embodiments are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.