Power module package for direct cooling multiple power modules
US12308364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2023 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Dec 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.