Substrate-free integrated circuit structures

US12317590B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Biswajeet Guha · Hillsboro, US
• Brian J. Greene · Wappingers Falls, US
• Avyaya Jayanthinarasimham · Hillsboro, US
• Ayan Kar · Portland, US
• Benjamin Orr · Munich, DE
• Chung-Hsun Lin · White Plains, US
• Curtis Tsai · Beaverton, US
• Kalyan C. Kolluru · Portland, US
• Kevin J. Fischer · Hillsboro, US
• Lin Hu · Livingston, US
• Nathan Jack · Forest Grove, US
• Nicholas A. Thomson · Hillsboro, US
• Rishabh Mehandru · Portland, US
• Rui Ma · Naperville, US
• Sabih OMAR · Hillsboro, US

Key dates

• Filing date: Sep 25, 2020
• Grant date: May 27, 2025
• Expiry date: Apr 11, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/853

Abstract

Substrate-free integrated circuit structures, and methods of fabricating substrate-free integrated circuit structures, are described. For example, a substrate-less integrated circuit structure includes a fin, a plurality of gate structures over the fin, and a plurality of alternating P-type epitaxial structures and N-type epitaxial structures between adjacent ones of the plurality of gate structures.